Job Listing Description

Electrocincs Packaing Design Engineer

Description:
Global defense contractor in MD is looking for a seasoned engineer for a long term contract assignment.

Basic Qualifications:
• Minimum 7+ years' experience in microelectronics packaging design or related field (which may include technologies such as organic PWBs, multilayer ceramic packages, flip chip, 2.5D/3D packaging, MCM, QFN, IMA, etc.)
• Proficient with NX CAD software
• Proficient with design and routing of high density Printed Wiring Boards (PWBs)
• Able to communicate and collaborate effectively as a member of an integrated product design team
• Bachelor's degree in mechanical engineering or related field
• US Citizen, with ability to obtain a Secret clearance

Desired Qualifications:
• Proficient with Mentor Expedition software
• Familiar with heat transfer methodologies for electronics, and thermal analysis tools
• Familiar with manufacturing and test methodologies of microelectronics assemblies and PWBs
• Master's degree in mechanical engineering or related field
 
Job Number: 5867
Job Location: Baltimore, MD
Rate: Open
Per Diem: No
Overtime: Possible
Duration: LT
Start Date: ASAP
Input Date: 02/04/2020
Firm Name: HEPCO INC
Attention: Tom Lee
Address: 160 PEHLE AVE STE 202
City, State: SADDLE BROOK, NJ 07663-5227
Phone: 201/843-4400
800 Phone: 800/656-0099
Fax Phone: 201/843-0025
Email: leet@hepcoinc.com
Website: www.hepcoinc.com

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