Candidate must be able to perform all aspects of the following semiconductor device processes: Wafer applications and FPA Manufacturing; preparation and use of wet chemical processes needed to etch and prepare semiconductor surfaces and etch patterns in semiconductor, dielectric and metal films; and operate within and maintain cleanliness requirements of class 100 clean room.
Position requires complete knowledge of safe handling processes for hazardous chemicals and chemical waste, the ability to enter process information into production and engineering level computer databases.
Applicant must be able to interface and coordinate with engineers and technicians in other areas of the semiconductor fabrication process such as thin film coating, dicing and assembly and test operations.
This is a First & Second shift position with initial training performed during first shift.
Once hired, candidate should expect to rotate and learn different functions of the production floor during their employment.
High School diploma, or equivalent experience/combined education, with additional technical training sufficient enough to perform required basic calculations, electronic/mechanical assembly/test, computer operations, etc. and less than 1 Year of experience.
Candidate will have at least some experience in semiconductor device processing.<br/>Previous experience working in a clean room environment.