Job Listing Description

Lead CAD Engineer

PDS Tech, Inc. is seeking a Lead CAD Engineer in Northford, CT

Key Responsibilities
  • Design double sided, multi-layered and flexible PCB’s using industry standard techniques (IPC), ensuring consideration for Design for Manufacturing.
  • This role requires working within a multi-disciplinary team of engineers to design high quality, high speed, low noise analogue, Wireless and RF printed circuit boards in accordance with electrical, mechanical, and company specific requirements and processes.
  • Must be capable of completing PCB designs in accordance with agreed project time, cost, quality and performance requirements.
  • Determination of layer stackup, perform component package selection, component placement, routing feasibility studies, and signal routing of digital, analog, RF and power conversion.
  • Creation and release of documentation for fabrication of PCBs.
  • Collaborate with internal teams and PCB vendors to continually improve design rules, constraints and Design for Test and Manufacture guidelines.
  • Support and train Electronical Engineers in Mentor Design tools for new functionality or as Mentor tools beginner.
  • Be part of the ECAD tools team ensure that the full functionality of the tools is maintained at all times for the User.

Must Haves:
  • 5+ years’ experience working with ECAD Tools Mentor Xpedition, or other relevant Software tools
  • 2+ years’ experience of use of electrical engineering concepts as applied to PCB design, Signal Integrity (SI), and Power Integrity (PI).

We Value: 

  • This position requires a Bachelor of Science degree or equivalent education and experience, in an appropriate engineering discipline or related physical science.
  • The candidate must have a minimum of 3 years PCB design experience in electronic packaging/printed circuit board layout for Industrial/Commercial applications using Mentor Expedition.
  • Experience using IPC specifications and recommendations in a production environment.
  • Preferred candidates will be experienced with Xpedition (Mentor Graphics) and multi-layer routing methods, fabrication drawings and a controlled engineering release process.
  • Experience with breakout and layout of high-density BGA/LGA packages.
  • Experience with other programs such as Altium, Allegro/Cadence is desired.
  • A candidate with a solid understanding of PCB design and electronic packaging for industrial/commercial applications including electrical, electronic and mechanical systems design is highly desired.
  • Experience working with PCB suppliers for DFM and design release is desired.
  • IPC CID Certification is desired.
  • Attention to detail, a high level of accuracy, self-motivating and the ability to plan and organize own tasks.
  • Thorough understanding of Electronic principles.
  • Knowledge about the latest state-of-the art devices, techniques and technical developments and theories associated with the PCB Design discipline.
  • Experience with ERP systems, BOM structures.
  • Knowledge of PCB fabrication process.
  • Knowledge of PCB material selection.
  • Experience in RF circuit layout and laminates.
  • High speed layout techniques for differential pair and serial communications.
  • Design multilayer stackups (up to 10 layers)
  • Calculate controlled impedance.
  • Place high density and high quantity of components.
  • Design and Layout Digital, Analog, and Mixed Signal layouts.
  • Demonstrated understanding of Design for Manufacturability, Assembly, and Test
  • Experience with layout of high speed buses, FPGA, DRAM and CPU designs, power supplies, DC-DC converters, transmission lines, and power traces.
  • Experience in routing per embedded CES/DRC rules
  • Experience with Hyperlynx DRC desired.

Job Number: 2110138604
Job Location: Northford, CT
Duration: 6 months
Input Date: 10/13/2021
Attention: Amy Merritt
Address: P O BOX 619820
City, State: DALLAS, TX 75261-9820
Phone: 214/647-9600
800 Phone: 800/270-4737
Fax Phone: 214/647-9636

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