Job Listing Description

Electronic Packaging Engineer Level - 3 -TX

Description:
Chipton-Ross is seeking a Electronic Packaging Engineer Level - 3 for an opening in Dallas, Texas

RESPONSIBILITIES:
Cadence Allegro (version 16 or later) printed wiring board and printed wiring board assembly design and fabrication expertise to include: board material selection, lay-up of prepregs and laminates, controlled impedance design, component selection, site surveys, support of FRBs, support of design reviews, and establishment/review of manufacturing process plans and repair procedures.

REQUIRED EXPERIENCE:
Cadence Allegro (version 16 or later); experience with tool constraints; minimum of 5 years of experience; experience with IPC class 3 design (military)

DESIRED EXPERIENCE:
RF printed wiring board design experience

EDUCATION: High School Diploma

WORK HOURS: Full Time 1st Shift
 
Job Number: 160637
Job Location: Dallas, TX
Rate: Up to $55.00 DOE
Duration: 3 months
Input Date: 05/02/2017
Firm Name: CHIPTON ROSS
Attention: Melody Mullins
Address: 343 MAIN ST
City, State: EL SEGUNDO, CA 90245
Phone: 310/414-7800 X286
800 Phone: 800/927-9318
Fax Phone: 310/414-7808
Email: mmullins@chiptonross.com
Website: www.chiptonross.com

Previous Listing       Next Listing
Back to Abbreviated Search Results
Back to Complete Search Results
Back to Advanced Job Search

Phone: (425) 806-5200
Email: staff@cjhunter.com
ContractJobHunter is a service of:
C.E. Publications, Inc.
P.O. Box 3006, Bothell, WA 98041-3006, USA
Disclaimer
The content of this website is Copyright 2017 C.E. Publications, Inc.